Vertiv Launches CoolCenter Immersion for Next-Gen AI and HPC Cooling
Immersion cooling submerges entire servers in a dielectric liquid, providing efficient and uniform heat removal across all components, where power densities and thermal loads exceed the limits of traditional air-cooling methods.
Vertiv, a global leader in critical digital infrastructure, today introduced the Vertiv™ CoolCenter Immersion cooling system, expanding its global liquid cooling portfolio to support AI and high-performance computing (HPC) environments that are ready to maximize the superior thermal properties of liquid cooling. The system is available now in Europe, the Middle East, and Africa (EMEA).
Immersion cooling submerges entire servers in a dielectric liquid, providing efficient and uniform heat removal across all components, where power densities and thermal loads exceed the limits of traditional air-cooling methods. Vertiv CoolCenter Immersion serves as a complete liquid-cooling architecture, enabling reliable heat removal for dense compute ranging from 25 kW to 240 kW per system.
“Immersion cooling is playing an increasingly important role as AI and HPC deployments push thermal limits far beyond what conventional systems can handle. With the Vertiv CoolCenter Immersion, we’re applying decades of liquid-cooling expertise to deliver fully engineered systems that handle extreme heat densities safely and efficiently, giving operators a practical path to scale AI infrastructure without compromising reliability or serviceability.”
– Sam Bainborough, EMEA Vice President of Thermal Business, Vertiv
The Vertiv CoolCenter Immersion is available in multiple configurations, including self-contained and multi-tank options, with cooling capacities from 25 kW to 240 kW. Each system includes an internal or external liquid tank, coolant distribution unit (CDU), temperature sensors, variable-speed pumps, and fluid piping, delivering precise temperature control and consistent thermal performance. Dual power supplies and redundant pumps provide high cooling availability, while integrated monitoring sensors, a 9-inch touchscreen, and building management system (BMS) connectivity simplify operation and system visibility. The system’s design also enables heat reuse opportunities, supporting more efficient thermal management strategies across facilities and aligning with broader energy-efficiency objectives.
Vertiv™ Liquid Cooling Services provide end-to-end expertise, from system design and installation to maintenance, training, and lifecycle optimization, helping customers evaluate and deploy the most effective liquid-cooling architectures. Supported systems include rear-door heat exchangers, direct-to-chip liquid cooling, and immersion cooling, enabling reliable, scalable, and efficient thermal management for AI, HPC, and other high-density computing environments.
